IC
Axiro Semiconductor — Bengaluru
₹4–8 LPA (HireSetu estimate) · Entry level · Freshers eligible · Full-time · onsite
HireSetu listing reference 12245d — confirm requirements below, then apply on the employer site.
Quick answer: A six-month onsite internship in Bengaluru covering package assembly process for QFN, FCCSP, FCBGA and modules, with the physical builds happening at OSAT partners rather than in-house. Excel, data interpretation and packaging fundamentals carry the day-to-day work.
From Axiro Semiconductor's job posting
IC Package Process
Axiro Semiconductor is a fabless semiconductor design company headquartered in Bengaluru, driving innovation in RF, wireless infrastructure, satellite communication (Satcom), and high-speed connectivity solutions. Backed by CG Power & Industrial Solutions Ltd. part of the 120-year-old Murugappa Group. Axiro represents India’s leap into the global semiconductor arena. With millions of chips already powering global networks, a world-class team across India, the US, and Europe, and cutting-edge expertise spanning RF, mmWave, GaN, and next-generation communication technologies, Axiro is engineering the future of how the world connects, computes, and communicates.
For more details – www.axiro.com
Responsibilities
- Collaborate with Packaging, Design, Manufacturing, Supply Chain, and Quality teams to support package development activities.
- Assist in assembly process development and optimization for QFN, FCCSP, FCBGA, and module-based packages.
- Support OSAT partners in new product introduction (NPI), process qualification, and manufacturing readiness activities.
- Analyze process performance data to identify opportunities for yield improvement and defect reduction.
- Participate in failure analysis, root cause investigations, and corrective action implementation for quality and reliability issues.
- Support process characterization, validation, and standardization efforts across package assembly operations.
- Prepare technical reports, presentations, and engineering documentation to communicate project progress and results.
- Contribute to continuous improvement initiatives focused on manufacturing efficiency, process robustness, and product quality.
Requirements
- Currently pursuing or recently completed a B.E./B.Tech/M.E./M.Tech/MSC in Electronics, Electrical Engineering, Materials Science, Semiconductor Technology, Applied Physics, or a related discipline.
- Basic understanding of semiconductor devices, fabrication processes, and semiconductor packaging technologies.
- Strong analytical, problem-solving, and data interpretation skills.
- Proficiency in Microsoft Excel and PowerPoint; familiarity with statistical analysis tools
Learning Opportunities
- Gain hands-on experience in advanced semiconductor package development and assembly processes.
- Work closely with industry experts, OSAT partners, and cross-functional engineering teams.
- Develop practical knowledge of QFN, FCCSP, FCBGA, and module package technologies.
- Learn semiconductor packaging process flows, qualification methodologies, yield analysis, and quality improvement techniques.
- Exposure to new product introduction (NPI), process optimization, and manufacturing operations in a high-tech semiconductor environment.
Desired Attributes
- Strong analytical thinking and structured problem-solving approach.
- Effective communication and presentation skills.
- Ability to collaborate in a cross-functional and fast-paced engineering environment.
- Eagerness to learn and adapt to new technologies and challenges.
- Passion for semiconductor devices, packaging technologies, and manufacturing excellence.
Additional Information
Preferred CGPA: 7.0/10 or above
Internship Duration: 6 Months
Career Opportunity: High-performing interns may be considered for a full-time employment opportunity upon successful completion of the internship, based on individual performance, business requirements, and role availability.
Text from Axiro Semiconductor's official job posting, formatted by HireSetu. The employer's own page is the final word on details.
HireSetu's note
The assembly line belongs to someone else
Axiro is fabless, so the packages this role covers get assembled and tested at OSAT partners. An intern works on the data that comes back from those partners: build and qualification reports, defect logs, yield tables, corrective actions. Expect the working day to run on Excel and PowerPoint, building pivot tables and trend charts that a partner or a design team has to read and act on.
If your mental picture is standing at an assembly line with a microscope, redraw it. You'll be the person questioning what a partner's line reported and turning it into something an engineer can use. College lab work or a project where you collected measurements and argued about what they meant is close to this job.
Six months, and a conditional door at the end
The internship runs a fixed six months, onsite in Bengaluru. Conversion to full-time is written in, but it comes with three conditions: your performance, business requirements and role availability. Two of those sit outside your control, so treat the conversion as something to earn, not a plan to build on.
The preferred 7.0 CGPA will be treated as a screening cutoff by most campus filters. The degree list is wider than it first reads, taking in materials science and applied physics alongside electronics, so this isn't reserved for VLSI students. Before you accept, ask how many interns the packaging team has converted in past cycles, and which OSAT partners an intern would work with week to week. Those two answers tell you more than the posting does.
Drafted with AI from Axiro Semiconductor's job posting and checked by Prashanth Jakkula before publishing. See our Editorial Policy.
How to apply
- Open Axiro Semiconductor's careers site with the Apply button.
- Follow the application steps on the site and upload your resume.
- Keep the confirmation email or application number for follow-up.
Apply on Axiro Semiconductor's site
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