IC Packaging and RF Simulation
Axiro Semiconductor — Bengaluru
₹2–5 LPA (HireSetu estimate) · Entry level · Freshers eligible · Full-time · onsite
HireSetu listing reference 1461ef — confirm requirements below, then apply on the employer site.
Quick answer: An EM and RF simulation internship at a Bengaluru fabless chip company, working on packages, substrates and high-speed interconnects with HFSS, CST, ADS and SIwave. No prior experience required, and the package and signal integrity fundamentals are what really get weighed.
From Axiro Semiconductor's job posting
IC Packaging and RF Simulation
Axiro Semiconductor is a fabless semiconductor design company headquartered in Bengaluru, driving innovation in RF, wireless infrastructure, satellite communication (Satcom), and high-speed connectivity solutions. Backed by CG Power & Industrial Solutions Ltd. part of the 120-year-old Murugappa Group. Axiro represents India’s leap into the global semiconductor arena. With millions of chips already powering global networks, a world-class team across India, the US, and Europe, and cutting-edge expertise spanning RF, mmWave, GaN, and next-generation communication technologies, Axiro is engineering the future of how the world connects, computes, and communicates.
For more details – www.axiro.com
Job Description
The IC Packaging and RF Simulation Intern will support the design, modeling, and optimization of advanced semiconductor packages and RF interconnect structures. The intern will work closely with Package Design, Signal Integrity (SI), Power Integrity (PI), and RF Engineering teams to analyze electrical performance, perform electromagnetic simulations, and contribute to the development of next-generation semiconductor products.
Responsibilities
- Perform electromagnetic (EM), RF, and signal integrity simulations for IC packages, substrates, and high-speed interconnects.
- Develop and validate simulation models using tools such as Ansys HFSS, CST Studio Suite, ADS, and SIwave.
- Analyze S-parameters, insertion loss, return loss, impedance discontinuities, crosstalk, and resonance effects.
- Support package design optimization to meet electrical and RF performance requirements.
- Correlate simulation results with laboratory measurements and characterization data.
- Assist in package electrical model generation and validation.
- Prepare technical reports, presentations, and engineering documentation.
- Collaborate with Packaging, Design, Validation, and Manufacturing teams.
Requirements
- Pursuing or recently completed a B.E./B.Tech/M.E./M.Tech in Electronics & Communication, Electrical, Communication, RF & Microwave Engineering, Semiconductor Technology, or related fields.
- Basic understanding of Electromagnetic Theory, RF & Microwave Fundamentals, Transmission Lines, Signal Integrity (SI), Power Integrity (PI), and Semiconductor Packaging Concepts.
Preferred Skills
- Familiar with Ansys HFSS, CST Microwave Studio, Keysight ADS, Ansys SIwave, or Cadence AWR.
- Exposure Wire Bond, Flip-Chip BGA, FC-CSP, WLCSP, or 2.5D/3D packaging.
- Programming or scripting knowledge in Python, MATLAB, or VBA.
- Understanding package substrates, PCB design, and high-speed interfaces.
Learning Opportunities
- Hands-on experience with semiconductor package design and RF simulation.
- Exposure advanced package technologies and high-speed interconnect design.
- Experience correlating simulation and measurement data.
- Mentorship from experienced Package, SI/PI, and RF engineers.
Desired Attributes
- Strong analytical and problem-solving skills.
- Effective communication and presentation abilities.
- Ability to work in a collaborative engineering environment.
- Passion for RF engineering, semiconductor packaging, and simulation technologies.
Preferred CGPA: 7.0/10 or above
Text from Axiro Semiconductor's official job posting, formatted by HireSetu. The employer's own page is the final word on details.
HireSetu's note
The theory carries the weight
Electromagnetic theory, RF and microwave fundamentals, transmission lines, SI, PI and packaging concepts sit under Requirements. The simulation tools sit under Preferred. You can learn HFSS or CST on the job. The fundamentals are what you bring, because a simulation result means nothing if you can't say why the structure behaves that way.
If you've used one of those tools for a project or a thesis, say which one and what you simulated. Listing four packages you've opened once carries little weight.
Learn to read the outputs
The role is built around S-parameters, insertion loss, return loss, crosstalk and resonance. If those are only half-remembered from a course, spend a weekend on transmission line theory and a Smith chart before you apply.
Packaging types appear in the preferred list: wire bond, flip-chip BGA, FC-CSP, WLCSP, 2.5D and 3D. You don't need experience with them, but you should picture a cross-section when you hear the name. Python or MATLAB scripting gets a mention too, and simulation sweeps are miserable to run by hand.
Clarify the intern label
The posting is onsite in Bengaluru, carries zero years of experience and is labelled both intern and full-time. Those can sit together, but the terms don't follow from the title. Ask about the duration, whether it's fixed-term or permanent from day one, and how often interns move into full-time roles.
Also ask which team you'd be placed with. The listing names package design, SI, PI and RF, and a year in any one of them looks quite different. The stated CGPA preference is 7.0, so know where you stand.
Where this specialism goes
SI/PI and package simulation is narrow work, and India has few engineers with genuine EM simulation experience at package level. That shortage works in your favour over the next few years. Signal integrity engineer and package design engineer are the natural next titles, here or at the design houses and OSAT operations being set up locally.
The correlation between simulation and lab measurement is the part you can't pick up from a course, so take the characterisation work seriously when it comes.
Drafted with AI from Axiro Semiconductor's job posting and checked by Prashanth Jakkula before publishing. See our Editorial Policy.
How to apply
- Open Axiro Semiconductor's careers site with the Apply button.
- Follow the application steps on the site and upload your resume.
- Keep the confirmation email or application number for follow-up.
Apply on Axiro Semiconductor's site
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