Silicon Packaging Design Engineer
Intel — Bengaluru, Karnataka
₹5–12 LPA (HireSetu estimate) · Entry level · Freshers eligible · Full-time · onsite
HireSetu listing reference a59cc4 · employer requisition JR0286703 — confirm requirements below, then apply on the employer site.
Quick answer: An entry-level Intel role in Bengaluru doing package substrate layout and routing from concept through tapeout. A diploma plus six months of PCB or packaging design clears the stated bar.
From Intel's job posting
Job Description
Join our team as a Silicon Packaging Design Engineer in the Data Center Group, where you will play a pivotal role in crafting cutting-edge silicon packaging solutions that drive Intel's innovation and technological leadership. In this role, you will be engaged in the end-to-end development of substrate designs, from concept to tapeout, ensuring optimized performance and manufacturability. Collaborating closely with cross-functional teams, your contributions will directly impact product quality, cost efficiency, and time-to-market for Intel's next-generation technologies. This is an exciting opportunity to start your career in a collaborative environment that fosters learning and professional growth.
Key Responsibilities
- Drive the complete development of substrate designs, starting from initial concept through tapeout.
- Perform physical layout and routing of package designs, ensuring adherence to design requirements.
- Conduct substrate fit and routing studies to establish optimal tradeoffs between design, performance, and cost.
- Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout configurations.
- Define and implement substrate design rules to meet product and manufacturing requirements.
- Perform internal and external design reviews, analyze data, and resolve design rule violations (DRCs).
- Integrate design documentation and collateral into the product lifecycle management system.
- Continuously seek opportunities to improve package design for manufacturability (DFM) and quality assurance.
Minimum Qualifications
- Diploma in Electronic/ Electrical Engineering or a related field.
- six months or more years of work experience in Semiconductor field related to design of silicon packaging or PCB.
- Novice to intermediate proficiency in substrate design and development, including physical layout and routing.
- Basic understanding of I/O fundamentals, package interconnect, and power delivery principles.
- Familiarity with design for manufacturability (DFM) and quality assurance processes.
- Strong problem-solving skills with a disciplined approach to execution.
Preferred Qualifications
-Preferred experience into E-CAD tool.
- Effective communication skills to convey technical information and collaborate with cross-functional teams.
- A proactive mindset to identify design improvement opportunities and ensure alignment with project goals.
- Passion for driving innovation and contributing to complex engineering challenges.
This is your opportunity to be part of Intel's legacy of innovation while developing your skills and advancing your career. Apply now and help us shape the future of technology.
Shift
Shift 1 (India)
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
The employer’s company overview, benefits and equal-opportunity statement are left out here; they are on the original posting.
Text from Intel's official job posting, formatted by HireSetu. The employer's own page is the final word on details.
HireSetu's note
Substrate work sits between the die and the board
Package substrate design happens on the small slab that carries signals between the silicon die and the motherboard, so the geometry is finer and the constraints tighter than at board level. Your routing gets squeezed from above by the die's bump pattern and from below by the board's ballout, and the fit and routing studies are where those two get reconciled. PCB layout is the closest neighbouring skill, though the scale is a step down from what a board designer is used to.
A diploma and six months is the stated bar
The stated minimum is a diploma in electronics or electrical engineering plus six months in semiconductor packaging or PCB design, and Intel has filed this as a college grad opening. That is a low bar for a company this size, and it tells you the team is hiring for trainability at entry level. E-CAD familiarity is preferred, so a different layout tool plus a real interest in substrate work is a reasonable position to apply from.
Onsite in Bengaluru, first shift
The role is onsite in Bangalore on Shift 1, so there is no remote arrangement to negotiate. Work out which team you'd sit with, because this job crosses the silicon and hardware groups and the day-to-day differs depending on which side owns the design. Ask which E-CAD tool the group runs and how much ramp-up a new hire gets on it.
Rules, reviews and DRCs
Layout and routing are the visible part, but a chunk of every week goes to defining substrate design rules, clearing DRCs, sitting in design reviews and loading collateral into the product lifecycle management system. Those rules are the team's own constraint set, rewritten as manufacturing feedback comes in. Refresh I/O fundamentals, package interconnect and power delivery basics: they are the shared vocabulary with the silicon and board teams. The tapeout date is what everything else gets arranged around.
Drafted with AI from Intel's job posting and checked by Prashanth Jakkula before publishing. See our Editorial Policy.
How to apply
- Open Intel's careers site with the Apply button.
- Create a Workday account for Intel. Workday logins are separate for every company, so an account made for another employer won't work here.
- Upload your resume and check every auto-filled field; Workday often misreads dates and job titles.
- Answer the screening questions, submit, and look for the confirmation email from Workday.
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