Engineer/Associate Engineer – AI & Automation Engineer

Micron — Hyderabad - Phoenix Aquila

₹3–6 LPA (HireSetu estimate) · Entry level · Freshers eligible · Part-time · onsite

HireSetu listing reference 440001 · employer requisition JR105692 — confirm requirements below, then apply on the employer site.

Quick answer: The AI in the title is one block of four. Most of this job is semiconductor package development, with Python and ML used to automate the engineering around it.

From Micron's job posting

Package Development & Engineering

Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments.

Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems.

Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness.

Analyze engineering data, identify risks, document findings, and recommend technically sound actions.

Contribute to design-for-manufacturing, design-for-reliability, design quality, and first-pass qualification objectives.

Design, CAD & EDA

Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables.

Use CAD/EDA tools to support physical design, routing, logical design, design-rule validation, documentation, and release activities.

Work with multidisciplinary teams to resolve design, manufacturability, performance, and data-quality issues.

Support engineering standards, reusable design methods, templates, and best-known methods.

AI, ML & Automation

Develop automation for repetitive design, simulation, data-processing, validation, reporting, and engineering workflow activities.

Build or contribute to AI/ML models for design validation, optimization, prediction, anomaly detection, and simulation acceleration.

Create engineering assistants, copilot agents, dashboards, and data pipelines that improve decision speed and traceability.

Translate engineering challenges into scalable digital solutions with appropriate validation, documentation, security, and human oversight.

Measure solution effectiveness using clear engineering, quality, adoption, and cycle-time indicators.

Collaboration & Execution

Work effectively with global teams across PDE, product engineering, technology development, manufacturing, quality, suppliers, and business stakeholders.

Communicate technical information clearly through analyses, presentations, design reviews, and engineering documentation.

Participate in training, rotational assignments, mentoring, technical reviews, and continuous improvement initiatives.

Demonstrate ownership, learning agility, disciplined execution, and commitment to safe and ethical engineering practices.

Minimum Qualifications

Bachelor's or master's degree in mechanical engineering, Electrical Engineering, Electronics Engineering, Mechatronics, Materials Engineering, Semiconductor Engineering, Computer Science, Data Science, or a closely related discipline.

Strong foundation in engineering mathematics, physics, problem solving, and data interpretation.

Ability to learn semiconductor packaging concepts, design methods, manufacturing processes, and engineering systems.

Programming or scripting exposure in Python, MATLAB, C/C++, or equivalent language.

Ability to communicate clearly, collaborate across functions, and manage assigned work with discipline.

Data analytics and visualization

PLM/ALM exposure, including Teamcenter, change management, and master data

About Micron Technology, Inc.

To learn more, please visit micron.com/careers

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

The employer’s company overview, benefits and equal-opportunity statement are left out here; they are on the original posting.

Text from Micron's official job posting, formatted by HireSetu. The employer's own page is the final word on details.

HireSetu's note

The packaging work sets the bar

Three of the four responsibility blocks are packaging: feasibility studies, architecture evaluation, risk assessment, design for manufacturability and reliability. AI and ML is one block sitting next to CAD and EDA. A CS or data science graduate can apply, and the degree list is wide, but the fundamentals named are mechanical, electrical, materials and thermal.

Reading a package drawing, spotting a risk and writing it up for a review carries as much weight as the code you write, and the code is expected to serve the design work.

Layouts, scripts, design reviews

Time goes into CAD/EDA work, checking stack-ups and design rules, plus automation for the repetitive parts: data processing, validation, reporting. Dashboards and data pipelines are deliverables, and so are copilot-style engineering assistants. Colleagues sit in PDE, product engineering, manufacturing, quality and with suppliers, spread across global sites, so reviews and documentation eat real hours.

Part-time is an odd tag for this kind of engineering role. Confirm the hours and the engagement before planning around it.

Lead with the hardware side

Semiconductor packaging exposure, simulation, and PLM tools like Teamcenter are the named differentiators, so those go above coursework. Without them, pick a project where your code changed an engineering outcome: a script that cut a validation step from days to hours, a pipeline that flagged anomalies in test data. Python, MATLAB or C++ all count, so use the one you can explain line by line. Generative AI usage is another differentiator, and a real account of how you use it in engineering work beats a certificate.

The fundamentals underneath

Two sets of basics sit behind this work. Hardware: thermal resistance, CTE mismatch and warpage, solder joint fatigue, and why a package fails first-pass qualification. Data: anomaly detection, regression, and the gap between a model that scores well offline and one that holds up on a line. Sketching the stack-up of a DRAM or NAND package is a decent afternoon's revision.

Simulation is a preferred item, so FEA or thermal modelling from coursework is fair game to bring up.

Drafted with AI from Micron's job posting and checked by Prashanth Jakkula before publishing. See our Editorial Policy.

How to apply

  1. Open Micron's careers site with the Apply button.
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  3. Upload your resume and check every auto-filled field; Workday often misreads dates and job titles.
  4. Answer the screening questions, submit, and look for the confirmation email from Workday.

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