IC Package Development Engineer
Micron — Hyderabad, Telangana
₹4–15 LPA (HireSetu estimate) · Entry level · Freshers eligible · Full-time · onsite
HireSetu listing reference 4a028c — confirm requirements below, then apply on the employer site.
Quick answer: An entry-level, onsite job in Hyderabad that is really two roles: classical packaging work on substrates, stack-ups and thermal behaviour, plus building the automation, dashboards and AI/ML models the packaging team runs on. No packaging experience is expected. Programming exposure is.
From Micron's job posting
Req. ID
JR105692 IC Package Development Engineer
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Package Development & Engineering
- Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments.
- Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems.
- Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness.
- Analyze engineering data, identify risks, document findings, and recommend technically sound actions.
- Contribute to design-for-manufacturing, design-for-reliability, design quality, and first-pass qualification objectives.
Design, CAD & EDA
- Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables.
- Use CAD/EDA tools to support physical design, routing, logical design, design-rule validation, documentation, and release activities.
- Work with multidisciplinary teams to resolve design, manufacturability, performance, and data-quality issues.
- Support engineering standards, reusable design methods, templates, and best-known methods.
AI, ML & Automation
- Develop automation for repetitive design, simulation, data-processing, validation, reporting, and engineering workflow activities.
- Build or contribute to AI/ML models for design validation, optimization, prediction, anomaly detection, and simulation acceleration.
- Create engineering assistants, copilot agents, dashboards, and data pipelines that improve decision speed and traceability.
- Translate engineering challenges into scalable digital solutions with appropriate validation, documentation, security, and human oversight.
- Measure solution effectiveness using clear engineering, quality, adoption, and cycle-time indicators.
Collaboration & Execution
- Work effectively with global teams across PDE, product engineering, technology development, manufacturing, quality, suppliers, and business stakeholders.
- Communicate technical information clearly through analyses, presentations, design reviews, and engineering documentation.
- Participate in training, rotational assignments, mentoring, technical reviews, and continuous improvement initiatives.
- Demonstrate ownership, learning agility, disciplined execution, and commitment to safe and ethical engineering practices.
Minimum Qualifications
- Bachelor's or master's degree in mechanical engineering, Electrical Engineering, Electronics Engineering, Mechatronics, Materials Engineering, Semiconductor Engineering, Computer Science, Data Science, or a closely related discipline.
- Strong foundation in engineering mathematics, physics, problem solving, and data interpretation.
- Ability to learn semiconductor packaging concepts, design methods, manufacturing processes, and engineering systems.
- Programming or scripting exposure in Python, MATLAB, C/C++, or equivalent language.
- Ability to communicate clearly, collaborate across functions, and manage assigned work with discipline.
Preferred Qualifications and Differentiators
- Semiconductor packaging exposure
- Simulation exposure
- Experience working on AI/ML solutions
- Strong generative AI usage
- Data analytics and visualization
- PLM/ALM exposure, including Teamcenter, change management, and master data
Job Profile(s)
Semiconductor Design Engineer 2
Relocation level: (TBD)
Before Getting Started
Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:
- Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
- If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
Text from Micron's official job posting, formatted by HireSetu. The employer's own page is the final word on details.
HireSetu's note
The packaging side gets taught
The degree list is unusually wide: mechanical, electrical, electronics, mechatronics, materials, semiconductor, computer science, data science. Micron expects to teach package concepts, design methods and manufacturing processes, which is why the experience box reads zero. What you bring is engineering maths, physics and a habit of reading data carefully.
Spend some time on what a package actually does before you apply: it holds the die, routes signals out, spreads heat, and has to survive assembly and reliability testing. Substrate, stack-up and warpage are worth reading about. Nobody expects depth from a fresher, but the vocabulary lets you follow a design review.
The code half is a real deliverable
Alongside CAD and EDA work, this role builds automation pipelines, engineering copilots, dashboards and AI/ML models for design validation and anomaly detection. That mix is rare in a fresher posting, and it means your programming needs to be more than a line on your CV.
Pick one language, Python is the safe bet, and get comfortable with data handling, plotting and a little model building. A college project where you automated something tedious and measured the time saved is the kind of story this work runs on. Generative AI usage is listed as a differentiator, so knowing how to work with these tools properly counts for something.
Pin down the rotation early
The posting mentions rotational assignments, mentoring and training, with a job profile of Semiconductor Design Engineer 2. Ask how long the rotation runs, which teams you pass through, and where people land after it. Packaging sits between technology development, manufacturing and quality, so the day-to-day varies a lot by placement.
PLM and Teamcenter exposure is preferred. If you have used any version control or product data system, put it on the CV. Also confirm which Micron sites your work supports, since the Hyderabad team works with global groups and some calls will fall outside Indian hours.
Drafted with AI from Micron's job posting and checked by Prashanth Jakkula before publishing. See our Editorial Policy.
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